Picture Album
![](/upload/image/2017/06/23/1713331765.gif)
Details:
Grinding wheel for bevel machining of semiconductor material substrates.
Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.
Beveling silicon wafers | Beveling sapphire wafers | ||
Notch machining | Wheel size | φ3.8×36L×11T×8U×1.4X | φ3.8×36L×11T×8U×1.4X |
Features
Even and ne diamond layer minimizes processing damage.
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
Highly precise slotted shape and nishing technology support various wafer shapes.
Copper-less supported.
Beveling silicon wafers | Beveling sapphire wafers | ||
Notch machining | Wheel size | φ3.8×36L×11T×8U×1.4X | φ3.8×36L×11T×8U×1.4X |