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产品详细信息

Grinding wheel for bevel machining of semiconductor material substrates. 

Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.


 Beveling silicon wafersBeveling sapphire wafers
Notch machiningWheel sizeφ3.8×36L×11T×8U×1.4Xφ3.8×36L×11T×8U×1.4X



Features


Even and ne diamond layer minimizes processing damage. 
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life. 
Highly precise slotted shape and nishing technology support various wafer shapes. 
Copper-less supported.





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