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Notched Wheel for Silicon and Sapphire Wafers
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Notched Wheel for Silicon and Sapphire Wafers
产品详细信息

Grinding wheel for bevel machining of semiconductor material substrates.

Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.


Features


Even and ne diamond layer minimizes processing damage.
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
Highly precise slotted shape and nishing technology support various wafer shapes.
Copper-less supported.



Case Study

  Beveling silicon wafers Beveling sapphire wafers
Notch machining Wheel size φ3.8×36L×11T×8U×1.4X φ3.8×36L×11T×8U×1.4X