语言
宣传画册
Semiconductor Equipment
Surface Background Grinder
Auto surface background Grinder SAG-8110/8111
Applicable products
4-8 inch Si/LiTaO3/LiNbO3/SiC wafers
3-6 inch Sapphire slices
2-4 inch Square pieces
Equipment Accuracy
| Total Thickness variation (TTV) | um | 0.5-1.5 |
| Wafer To Wafer (WTW) | um | 1.5 |
| Roughness | um | Ra0.05(2000#)/Ra0.2(320#) |
| Minmun Thickness | um | Below 120 |
| Unit/Wafer Per Hour | pcs | 15 Fully-auto（both rough & fine） |
